PCB BGA SMD Lead-free Low Temperature SMT Melt Melting Point 138°C Solder Paste

Description

Application: necessary materials for PCB board repair. Suitable for paper boards that cannot withstand high temperature or other special welding
Features:
Lead-free environmental protection, low melting point, no continuous tin, no shift.
Product Description:
Model: WNB 138℃ Flux Solder Paste
Composition: Sn42Bi58
Particles: 4um
Material: Solder paste material
Wetability: good wettability and high reliability.
Function: Can effectively prevent printing collapse and preheating.
Features: long-lasting stickiness, easy to dry, sticky time more than 48 hours.
Environmental performance: colorless and transparent, does not affect testing, fine cleaning and cleaning performance.
Storage: The product has strong wettability, strong resistance to drying, and has a long shelf life at room temperature.
Capacity: 30g/50g/100g
Package list:
1* solder paste syringe (1 solder paste, 1 pin, 1 push rod)