Solid Soldering Paste With Needles For BGA Ball No-Clean Solder Flux Top Quality

Description

Solid Soldering Paste With Needles For BGA Ball No-Clean Solder Flux Top Quality
Specifications:
Capacity: 10CC
Model: RMA-218
Color: As shown
Suitable for BGA ball, semiconductor packaging, repair.
Computer motherboard north and south bridge, communications,
graphics and other BGA apply.
Features:
This product is no-clean solder paste, very little residue, without washing.
The residue is colorless and transparent appearance outstanding.
Excellent printing performance with suitable hand and machine print.
Is currently the best on the market BGA, CSP rework help paste.
Just apply a little each time
When the bumping of the BGA chip coated with flux paste and PCB pads are required coat,
Good BGA soldering flux paste and machine regardless of manual welding,
the success rate is greatly increased.
Package includes:
2 x Solder Paste
2 x Needles